State-of-the-art production facilities
High-speed surface mount technology for precision PCB assembly with 3D solder paste inspection (SPI), automated optical inspection and quality control systems.
Advanced wave soldering for through-hole components with precise temperature control and flux management.
Air-conditioned environment with dust control for precision molding and consistent part quality.
High-precision solder paste inspection for quality assurance.
All components verified against specifications before production
Automated optical inspection at critical stages. Including SPI inspection
Functional testing and burn-in for reliability before packing